西安紫光国芯半导体有限公司

西安紫光国芯半导体有限公司（简称“西安紫光国芯”）前身为成立于2004年德国英飞凌西安研发中心的存储事业部，2006年分拆成为独立的奇梦达科技西安有限公司，2009年被浪潮集团收购转制成为国内公司并更名为西安华芯半导体有限公司。2015年被紫光集团收购并更名为西安紫光国芯半导体有限公司。

公司是国家高新技术企业、陕西省企业技术中心、陕西省知识产权示范企业，承担多个国家级重大研发专项，拥有掌握存储器和集成电路核心设计与测试技术的国际化团队，已经发展成为包括产品研发、规模量产和全球销售的综合性集成电路设计企业。

西安紫光国芯是以DRAM（动态随机存取存储器）存储技术为核心的产品和服务提供商，核心业务包括存储器产品设计开发及量产销售、专用集成电路设计开发服务、SeDRAM™（异质集成嵌入式DRAM）及存储控制芯片的设计开发及量产销售。产品包括DRAM KGD、DRAM颗粒、DRAM模组、系统产品和设计服务。公司自成立以来，一直专注于存储器特别是DRAM存储器的研发和技术积累，产品持续量产销售到国内外，积累了良好的存储器/SoC的设计、测试、规模生产及全球销售等研发和产业化经验。

公司历时七年成功开发出的SeDRAM™技术是目前世界领先的超大带宽、超大容量、超低功耗内嵌存储器解决方案，已率先实现基于SeDRAM™平台的超大带宽产品的大规模量产和销售。多项研发成果先后在IEDM 2020、CICC 2021、IMW 2021、A-SSCC 2021、ISSCC 2022等多个业界顶级期刊和会议上公开发表和作专题报告。

Xi'an UnilC Semiconductors Co., Ltd. (Xi'an UnilC), formerly known as the Memory Development Division of Xi'an R&D Center of Infineon Technologies in 2004, was renamed Qimonda Technologies (Xi'an) Co., Ltd. in 2006. After being acquired by lnspur Group in 2009, the entity became a domestic company and was renamed Xi'an Sinochip Semiconductors Co., Ltd. It came to the present name after the acquisition by Tsinghua Unigroup in 2015.

Being a National High-tech Enterprise, Shaanxi Provincial Enterprise Technology Center, and Shaanxi Provincial Exemplary Enterprise on IP Standards Implementation, Xi'an UnilC is capable of undertaking several major national research projects with an international R&D team with crucial memory and ASIC design and testing technologies.  Xi'an UnilC has developed into a comprehensive integrated circuit design enterprise, including product research and development, mass production, and global sales.

Xi'an UnilC is a product and service Provider focusing on Dynamic Random Access Memory (DRAM), whose core businesses include the development, design, mass production, and sales of memory products, stacked embedded DRAM using hybrid bonding 3D integration (SeDRAM™), and memory controller, as well as ASIC design services. Products of Xi’an UniIC include DRAM KGD, DRAM components, DRAM modules, and system products. Since its establishment, the company has been working on the R&D in memory, especially DRAM technologies. Many products have achieved mass production and are sold to domestic and international customers. The company has accumulated extensive R&D and industrialization experience in memory design, testing, mass production, and global sales and marketing.

SeDRAM™, the outcome of 7-year research and development, is a world-leading technology that accomplished the integration of DRAM wafer and SoC wafer using Hybrid Bonding and thus put forward a perfect solution to the absence of embedded DRAM with ultra-high bandwidth, super-large articles and density, and extremly-low power consumption. At the same time, some of these products have firstly achieved large-scale mass production and sales, and thus reports associated with these products have been delivered in such prestigious meetings as IEDM 2020, CICC 2021, IMW 2021, A-SSCC 2021, and ISSCC 2022.